Broadcom and Samsung’s expanded pact could unleash $1 trillion revenue wave
Jul 28
1 min read
BARRON’S — The next five years of collaboration will combine Broadcom’s expertise in designing application-specific integrated circuits (ASICS), or chips for specific AI use cases, with Samsung’s robust manufacturing capabilities on both memory and semiconductor tech.
“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic, and advanced packaging,” Young Hyun Jun, CEO of the device solutions division at Samsung Electronics, said
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